Abstract

Surface behaviour is very important for which substrate surface preparation is emphasized in electroless deposition process. It directly or indirectly affects surface behaviour as well as the kinetics of electroless deposition process. So far as mechanism is concerned, it proceeds in an electrochemical pathway. The electrochemical approach provides clarity of the mechanism by studying independently the partial anodic and cathodic reactions in electroless deposition of copper. The reducing and complexing agents play a vital role for the kinetics and mechanism of the process. The traditional reducing agent, formaldehyde, can be substituted by Glyoxylic acid since the latter (1.1 V) shows close electrode potential as that of formaldehyde (1.7 V) and is eco-friendly. In case of triethanolamine as a new complexing agent enhanced the deposition rate and gives a thicker bright deposit of copper.

Key words: Electroless, copper, glyoxylic acid, kinetics, mechanism.