Abstract

Sn-3.7wt.%Ag-0.9wt.%Zn alloy was directionally solidified upward under different conditions, with different growth rates (V = 3.38 - 220.12 µm/s) at a constant temperature gradient (G = 4.33 K/mm) and with different temperature gradients (G = 4.33 -12.41 K/mm) at a constant growth rate (V = 11.52 µm/s) by using a Bridgman-type directional solidification furnace. The microstructure was observed to be a rod Ag₃Sn structure in the matrix of β-Sn from the directionally solidified Sn-3.7wt.%Ag-0.9wt.%Zn samples. The microhardness, tensile strength and electrical resistivity of alloy were measured from directionally solidified samples. The dependency of the microhardness, tensile strength and electrical resistivity on the solidification parameters for directionally solidified Sn-Ag-Zn eutectic alloy was investigated and the relationships between them were experimentally obtained by using regression analysis. The results obtained in the present work were compared with the previous similar experimental results.

Key words: Alloys, crystal growth, microstructure; mechanical properties, electrical properties.