This paper presents theoretical experimental and evidence of the effect of internal resonance at silicon substrate in micro fabrication ultrasonic transducer. This ringing is clearly observed in immersion transducers with 4.2 MHz and harmonics. A mathematical analytical model of the attenuation yield by ringing effective and simulation is introduced. Experimental results are further compared to simulations carried out in time-domain and qualitative agreement is provided. This paper summarizes the theoretical measured, performance backing layer. Experiment and simulation proved that it is possible to design a custom backing material with acoustic impedance that decreases the ringing mode.
Key words: Capacitive micro-machined ultrasonic transducers (CMUT), ultrasound sensor, backing layer, attenuation.
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