Journal of
Horticulture and Forestry

  • Abbreviation: J. Hortic. For.
  • Language: English
  • ISSN: 2006-9782
  • DOI: 10.5897/JHF
  • Start Year: 2009
  • Published Articles: 305

Full Length Research Paper

Substrate temperature and seed scarification on germination parameters of butterfly pea (Clitoria ternatea L.)

Sean M. Campbell
  • Sean M. Campbell
  • Department of Environmental Horticulture, University of Florida, Institute of Food and Agricultural Sciences, Mid-Florida Research and Education Center, 2725 South Binion Road, Apopka, Florida, 32703, United States of America.
  • Google Scholar
Brian J. Pearson
  • Brian J. Pearson
  • Department of Environmental Horticulture, University of Florida, Institute of Food and Agricultural Sciences, Mid-Florida Research and Education Center, 2725 South Binion Road, Apopka, Florida, 32703, United States of America.
  • Google Scholar
S. Christopher Marble
  • S. Christopher Marble
  • Department of Environmental Horticulture, University of Florida, Institute of Food and Agricultural Sciences, Mid-Florida Research and Education Center, 2725 South Binion Road, Apopka, Florida, 32703, United States of America.
  • Google Scholar


  •  Received: 07 October 2022
  •  Accepted: 14 November 2022
  •  Published: 30 November 2022

Authors

Sean M. Campbell
Department of Environmental Horticulture, University of Florida, Institute of Food and Agricultural Sciences, Mid-Florida Research and Education Center, 2725 South Binion Road, Apopka, Florida, 32703, United States of America.

Brian J. Pearson
Department of Environmental Horticulture, University of Florida, Institute of Food and Agricultural Sciences, Mid-Florida Research and Education Center, 2725 South Binion Road, Apopka, Florida, 32703, United States of America.

S. Christopher Marble
Department of Environmental Horticulture, University of Florida, Institute of Food and Agricultural Sciences, Mid-Florida Research and Education Center, 2725 South Binion Road, Apopka, Florida, 32703, United States of America.

Corresponding Author Email: [email protected]